general specifications flanged terminations 150 watts, 50 model RFP-150-50TG resistive element: thick film substrate: beryllium oxide ceramic cover: alumina ceramic mounting flange: copper, nickel plated per qq-n-290 lead(s): 99.99% pure silver (.005?thk) outline drawing tg rfp 150-50 (2 places) .130 dia. thru. .110 .400 .120 .100 .560 .800 .130 .060 .225 .350 .120 notes: t olerance is .010, unless otherwise specified. operating temperature is -55? to +150? (see chart). designed to meet or exceed applicable portions of mil-e-5400. all dimensions are in inches. lead length 0.15?minimum. specifications subject to change without notice. electrical specifications resistance value: 50 ohms, 5% frequency range: dc - 2.0 ghz power: 150 watts v .s.w.r.: 1.35:1 flanged terminations features dc - 2.0 ghz 150 watts beo ceramic ? elded silver leads non-nichrome resistive element low vswr 100% tested ? 1 sales desk usa: v oice: (800) 544-2414 fax: (315) 432-9121 sales desk europe: v oice: (+44) 23 92 232392 fax: (+44) 23 92 251369 ver. 12/5/01
flanged terminations model RFP-150-50TG t ypical performance 2 sales desk usa: v oice: (800) 544-2414 fax: (315) 432-9121 sales desk europe: v oice: (+44) 23 92 232392 fax: (+44) 23 92 251369 power derating suggested mounting procedures 1. make sure that the devices are mounted on flat surfaces (.001?under the device) to optimize the heat transfer. 2. drill & tap the heatsink for the appropriate thread size to be used. 3. coat heatsink with a minimum amount of high quality silicone grease (.001?max. thickness). 4. position device on mounting surface and secure using socket head screws, flat & split washers. torque screws to the appropriate value. make sure that the device is flat against the heatsink. (care should be taken to avoid upward pressure of the leads towards the lid). 5. solder leads in place using an sn63 type solder with a controlled temperature iron (210?). scale: board even with lead. than lead. board lower suggested stress relief methods (2 places) .025 min. not recommended application board lower than lead. than lead. board higher scale: % of rated power 150 125 100 75 50 25 100 75 25 50 0 case temperature ? c
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